www. g d \ v h p l m s 1 dual n-channel 20 v (d-s) mosfet features ? h a logen-free according to iec 61249-2-21 definition ? trenchfet ? power m osfet ? 100 % r g tested ? typical esd protection 2100 v hbm ? compliant to rohs directive 2002/95/ec applicat ions ? l oad switch for portable applications notes: a. package limite d. b. surface mounted on 1" x 1" fr4 board. c. t = 5 s. d. maximum under steady stat e conditions is 220 c/w. product summ ary v ds (v ) r ds(on) ( )i d (a ) a q g ( t yp.) 20 0.198 at v gs = 4.5 v 1.3 a 0.9 nc 0 .225 at v gs = 2.5 v 1.3 a 0 .263 at v gs = 1.8 v 1.3 a so t -363 sc-70 (6-leads) 6 4 1 2 3 5 to p v ie w s 1 g 1 d 2 d 1 g 2 s 2 d 1 s 1 g 1 d 2 s 2 g 2 absolute maximum ratings (t a = 25 c, unless otherwise noted) p aramet er symbol limit unit drain-source voltage v ds 20 v gat e -source voltage v gs 8 continuous d rain current (t j = 150 c ) t c = 25 c i d 1.3 a a t c = 70 c 1.3 a t a = 25 c 1.3 a, b , c t a = 70 c 1.2 b, c pulsed dr a in current i dm 4 contin uous sou rce-drain diode current t c = 25 c i s 1 t a = 25 c 0 .61 b, c max i mum power dissipation t c = 25 c p d 1.25 w t c = 70 c 0.8 t a = 25 c 0 .74 b, c t a = 70 c 0 .47 b, c ope r ating junction and storage temperature range t j , t stg - 55 to 150 c thermal resist ance ratings p arameter symb ol typical maximum unit maximum junction-to-ambient b, d t 5 s r thj a 130 170 c /w maximum junction-to-foot (drain) steady state r thjf 80 100 dt s www. daysemi.jp
w ww. g d \ v h p l m s 2 no t es: a. pulse test; pulse width 300 s, duty cycle 2 %. b. guaranteed by design, not s ubject to production testing. st resses beyond those listed under ?absolute maximum ratings? ma y cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. s pecif ications (t j = 2 5 c, unless otherwise noted) p a rameter symbol test conditions min. typ. max. unit static drain-source breakdo wn voltage v ds v gs = 0 v , i d = 250 a 20 v v ds t emper ature coefficient v ds /t j i d = 250 a 20 mv/c v gs( t h) t emper ature coefficient v gs(t h) /t j - 2. 3 gate-s ource threshold voltage v gs(t h) v ds = v gs , i d = 25 0 a 0. 4 1 v gate-source leakage i gss v ds = 0 v , v gs = 8 v 25 a v ds = 0 v , v gs = 4.5 v 1 zero gate voltage drain current i dss v ds = 20 v , v gs = 0 v 1 a v ds = 20 v , v gs = 0 v , t j = 55 c 10 on-state drain current a i d(o n) v ds 5 v , v gs = 4.5 v 4 a drain-source on-state re sistance a r ds(on) v gs = 4.5 v , i d = 1 a 0.165 0.198 v gs = 2.5 v, i d = 1 a 0.187 0.225 v gs = 1. 8 v, i d = 0 .2 a 0.210 0.263 forward transconductance a g fs v ds = 4 v, i d = 1.5 a 4 s dy nam ic b t o tal gate charge q g v ds = 10 v , v gs = 8 v , i d = 1.5 a 1.6 2.5 nc v ds = 10 v , v gs = 4.5 v , i d = 1.5 a 0.9 1.8 gate-s ource charge q gs 0.1 gate- dr ain charge q gd 0.2 g a te resistance r g f = 1 mhz 0. 4 1.9 3.8 k tu r n - o n d e l ay t i m e t d( on) v dd = 1 0 v, r l = 8.3 i d 1.2 a , v gen = 4.5 v , r g = 1 43 65 ns rise time t r 80 120 t urn-off delay time t d( off) 480 720 fa ll time t f 220 330 t urn-on delay time t d( on) v dd = 10 v , r l = 8.3 i d 1. 2 a, v gen = 8 v , r g = 1 22 33 rise time tr 46 70 turn-off delay time t d( off) 645 968 f all time tr 215 323 drain - source body diode characteristics continuous source-drain diode current i s t c = 25 c 1 a pulse diode forward current i sm 4 body diode v o ltage v sd i s = 1.2 a, v gs = 0 v 0 .8 1.2 v body diode reverse recovery time t rr i f = 1.2 a, di/dt = 100 a/s, t j = 2 5 c 918ns body diode reverse recovery charge q rr 24 n c reverse recovery fall time t a 5 ns re v erse recovery rise time t b 4 % 5 s www. e b z t f n j k q
www. g d \ v h p l m s 3 typica l c haracteristics (25 c, unless otherwise noted) g a te current vs. gate-to-source voltage output characteristics on-resistance vs. drain current v gs - gate-to-so u rce v oltage ( v ) i g - gate c u rrent (ma) 0 0.1 0.2 0.3 0.4 0.5 0369 1 215 t j = 25 c 0 1 2 3 4 0.0 0.5 1.0 1.5 2.0 v gs =5vt h ru2v v gs =1 . 5v v gs =1v v ds - drain-to-source voltage (v) i d - drain current (a) 0.13 0.16 0.19 0.22 0.25 012 34 v gs =1 . 8v v gs =2 . 5v v gs =4 . 5v r ds(on) - on-resistance ( ) i d - drain current (a) gate c u rrent vs. gate-to-source voltage transfer characteristics gate charge 10 -10 10 -9 10 - 8 10 -7 10 -6 10 -5 10 -4 10 -3 0369 1 215 v gs - gate-to-so u rce v oltage ( v ) i g - gate c u rrent (a) t j = 150 c t j = 25 c 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0 .3 0.6 0.9 1.2 1.5 t c = 125 c t c = 25 c t c = - 55 c v gs - gate-to-source voltage (v) i d - drain current (a) 0 2 4 6 8 0.0 0.5 1.0 1.5 2.0 i d =1. 5a v ds =10v v ds =1 6v v ds =5v q g - total gate charge (nc) v gs - gate-to-source voltage (v) dt s daysemi.jp
w ww. g d \ v h p l m s 4 ty pi cal characteristics (25 c, unless otherwise noted) on -res istance vs. junction temperature on-resistance vs. gate-to-source voltage single pulse power, junction-to-ambient 0.7 0.9 1.1 1.3 1.5 1.7 - 50 - 25 0 25 50 75 100 125 150 i d =1a v gs =4 . 5v v gs =2. 5v t j - junction temperature (c) (normalized) r ds(on) - on-resistance 0.0 0.1 0.2 0.3 0.4 123 45 t j = 25 c t j = 125 c i d =1a r ds(on) - on-resistance ( ) v gs - gate-to-source voltage (v) 0 1 5 power (w) t ime (s) 3 4 006 11 0 0.1 0.01 2 100 so urce-d rain diode forward voltage threshold voltage safe operating area, junction-to-ambient 0.0 0 .3 0.6 0.9 1.2 1.5 1 0.1 10 t j = 25 c t j = 150 c i s - source current (a) v sd - source-to-drain voltage (v) 0.20 0.35 0.50 0.65 0.80 - 50 - 25 0 25 50 75 100 125 150 i d = 250 a v gs(th) (v) t j - temperature (c) 10 0.1 0.1 1 10 1 t a = 25 c single pulse 1ms 0.01 1s ,1 0s dc 100 limited by r ds (on) * 10 ms 100 ms 100 s bvdss limited v ds - drain-to-source voltage (v) * v gs > minimum v gs at which r ds(on) is specied i d - drain current (a) dt s www. daysemi.jp
www. g d \ v h p l m s 5 typica l c haracteristics (25 c, unless otherwise noted) * t he po wer dissipation p d is based on t j( ma x) = 150 c, using junction-to-case thermal resi stance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. it is used to determine the current rating, when this rating falls below the package limit. current derating* 0.0 0.6 1.2 1.8 2.4 0 25 50 75 100 125 150 package limited t c - case temperature (c) i d - drain current (a) pow e r, junction-to-foot 0.0 0.3 0.6 0.9 1.2 1.5 0 25 50 75 100 125 150 t f - case temperature (c) power (w) pow e r, junction-to-ambient 0.00 0.15 0.30 0.45 0.60 0.75 0 25 50 75 100 125 150 t a - ambient temperature (c) power (w) dt s www. daysemi.jp
w ww. g d \ v h p l m s 6 ty pi cal characteristics (25 c, unless otherwise noted) . norm alized t hermal transient im pedance, junction-to-ambient 10 -3 10 -2 006 01 1 10 -1 10 -4 100 2 1 0.1 0.01 0.2 0.1 0.05 single pulse duty cycle = 0.5 square w ave pulse duration (s) normalized ef fective transient thermal impedance 1. duty cycle, d = 2. per unit base = r thj a = 170 c/w 3. t jm - t a = p dm z thj a (t) t 1 t 2 t 1 t 2 notes: 4. surface mounted p dm 0.02 no rmalized t hermal transient impedance, junction-to-foot 10 -3 10 -2 01 1 10 -1 10 -4 2 1 0.1 0.01 0.2 0.1 0.05 single p u lse d u ty cycle = 0.5 sq u are w a v e p u lse d u ration (s) n ormalized ef fecti v e transient thermal impedance 0.02 dt s www. daysemi.jp
l c e e 1 e d e 1 a 2 a a 1 1 -a- b -b- 23 65 4 www. g d \ v h p l m s 1
dim min nom max min nom max a 0.90 ? 1.10 0.035 ? 0.043 a 1 ? ? 0.10 ? ? 0.004 a 2 0.80 ? 1.00 0.031 ? 0.039 b 0.15 ? 0.30 0.006 ? 0.012 c 0.10 ? 0.25 0.004 ? 0.010 d 1.80 2.00 2.20 0.071 0.079 0.087 e 1.80 2.10 2.40 0.071 0.083 0.094 e 1 1.15 1.25 1.35 0.045 0.049 0.053 e 0.65bsc 0.026bsc e 1 1.20 1.30 1.40 0.047 0.051 0.055 l 0.10 0.20 0.30 0.004 0.008 0.012 7 nom 7 nom ecn: s-03946?rev. b, 09-jul-01 dwg: 5550 package information
www. g d \ v h p l m s 1 application note recommended minimum pads for sc-70: 6-lead 0.096 (2.438) recommended mi nimum pads dimensions in inches/(mm) 0.067 (1.702) 0.026 (0.648) 0.045 (1.143) 0.016 (0.406) 0.026 (0.648) 0.010 (0.241) return to index retu r n to index application note
legal disclaimer notice www. daysemi.jp 1 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. din-tek intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, din-tek ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. din-tek makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, din-tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on din-tek s knowledge of typical requirements that are often placed on din-tek products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify din-tek s terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, din-tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the din-tek product could result in personal injury or death. customers using or selling din-tek products not expressly indicated for use in such applications do so at their own risk. pleas e contact authorized din-tek personnel to ob tain written terms and conditions regarding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of din-tek . product names and markings noted herein may be trad emarks of their respective owners. material category policy din-tek intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some din-tek documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. din-tek intertechnology, inc. hereby certifi es that all its products that are identified as ha logen-free follow halogen-free requirements as per jedec js709a stan dards. please note that some din-tek documentation may still make reference to the iec 61249-2-21 definition. we co nfirm that all the products identified as being compliant to iec 61249-2-21 conform to jedec js709a standards. legal disclaimer notice www.daysemi.jp revision: 02-oct-12 1 document number: 72610 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. din-tek intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, din-tek ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. din-tek makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, din-tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on din-tek s knowledge of typical requirements that are often placed on din-tek products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify din-tek s terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, din-tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the din-tek product could result in personal injury or death. customers using or selling din-tek products not expressly indicated for use in such applications do so at their own risk. pleas e contact authorized din-tek personnel to ob tain written terms and conditions regarding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of din-tek . product names and markings noted herein may be trad emarks of their respective owners. material category policy din-tek intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some din-tek documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. din-tek intertechnology, inc. hereby certifi es that all its products that are identified as ha logen-free follow halogen-free requirements as per jedec js709a stan dards. please note that some din-tek documentation may still make reference to the iec 61249-2-21 definition. we co nfirm that all the products identified as being compliant to iec 61249-2-21 conform to jedec js709a standards.
|
